Editing Dual in-line package (section)

===Lead count and spacing===
Commonly found DIP packages that conform to [[JEDEC]] standards use an inter-lead spacing (lead pitch) of {{convert|0.1|in|mm|2}} (JEDEC MS-001BA). Row spacing varies depending on lead counts, with 0.3 in. (7.62&nbsp;mm) (JEDEC MS-001) or 0.6&nbsp;inch (15.24&nbsp;mm) (JEDEC MS-011) the most common. Less common standardized row spacings include 0.4&nbsp;inch (10.16&nbsp;mm) (JEDEC MS-010) and 0.9&nbsp;inch (22.86&nbsp;mm), as well as a row spacing of 0.3&nbsp;inch, 0.6&nbsp;inch or 0.75&nbsp;inch with a 0.07&nbsp;inch (1.778&nbsp;mm) lead pitch.

The former Soviet Union and Eastern bloc countries used similar packages, but with a metric pin-to-pin spacing of 2.5&nbsp;mm rather than {{convert|0.1|in|mm|2}}.

The number of leads is always even. For 0.3&nbsp;inch spacing, typical lead counts are 8, 14, 16, and 20; less common are 4, 6, 18, 24, and 28 lead counts. To have an even number of leads {{anchor|NC}}some DIPs have unused [[not connected]] (NC)<ref group="nb" name="NB_NC"/> leads to the internal chip, or are duplicated, e.g. two ground pins. For 0.6&nbsp;inch spacing, typical lead counts are 24, 28, 32, and 40; less common are 36, 42, 48, 52, and 64 lead counts. Some microprocessors, such as the [[Motorola 68000]] and [[Zilog Z180]], used lead counts as high as 64; this is typically the maximum number of leads for a DIP package.<ref name="CMOS_DI">{{cite book |title=CMOS digital integrated circuits |last=Kang |first=Sung-Mo |author2=Leblebici, Yusuf |year=2002 |publisher=McGraw-Hill |isbn=0-07-246053-9 |page=42|edition=3rd }}</ref>