Editing Pentium Pro (section)

==Packaging==
The Pentium Pro (up to 512&nbsp;KB cache) is packaged in a ceramic multi-chip module (MCM). The MCM has 387&nbsp;pins, of which approximately half are arranged in a pin grid array (PGA) and half in an interstitial pin grid array (IPGA). The packaging was designed for [[Socket 8]]. The MCM contains two underside cavities in which the microprocessor die and its companion cache die reside. The dies are bonded to a heat slug, whose exposed top helps the heat from the dies to be transferred more directly to cooling apparatus such as a heat sink. The dies are connected to the package using conventional wire bonding. The cavities are capped with a ceramic plate. The Pentium Pro with 1&nbsp;MB of cache uses a plastic MCM. Instead of two cavities, there is only one, in which the three dies reside, bonded to the package instead of a heat slug. The cavities are filled in with epoxy.