Editing Dual in-line package (section)

===Quad in-line===
[[File:R6511.jpg|thumb|upright=1|A Rockwell [[6502]]-based microcontroller in a QIP]]
{{Main|Quad in-line package}}

The QIP, sometimes called a ''QIL package'', has the same dimensions as a DIL package, but the leads on each side are bent into an alternating zigzag configuration so as to fit four lines of solder pads (instead of two with a DIL). The QIL design increased the spacing between solder pads without increasing package size, for two reasons: 	
# It allowed more reliable [[soldering]]. This may seem odd today, given the far closer solder pad spacing in use now, but in the 1970s, the heyday of the QIL, [[solder bridge|bridging]] of neighbouring solder pads on DIL chips was an issue at times,
# QIL also increased the possibility of running a [[copper]] track between 2 solder pads. This was very handy on the then standard single sided single layer PCBs.