Editing Transistor–transistor logic (section)

==Packaging==
Like most integrated circuits of the period 1963–1990, commercial TTL devices are usually packaged in [[dual in-line package]]s (DIPs), usually with 14 to 24 pins,<ref>
{{cite book
 | quote = [74-series] devices are usually encapsulated in a plastic 14-pin, 16-pin, or 24-pin dual-in-line package (DIP)
 | url = https://books.google.com/books?id=9g8BBQAAQBAJ&pg=PA16
 | first=R. M. |last=Marston
 | title = Modern TTL Circuits Manual
 | year = 2013
 | publisher = Elsevier
 | page = 16
 | isbn = 9781483105185
}}</ref> for [[through-hole]] or socket mounting. Epoxy plastic (PDIP) packages were often used for commercial temperature range components, while ceramic packages (CDIP) were used for military temperature range parts.

[[Beam lead technology|Beam-lead]] chip dies without packages were made for assembly into larger arrays as hybrid integrated circuits.  Parts for military and aerospace applications were packaged in [[Flatpack (electronics)|flatpacks]], a form of surface-mount package, with leads suitable for welding or soldering to printed circuit boards.  Today{{When|date=September 2018}}, many TTL-compatible devices are available in surface-mount packages, which are available in a wider array of types than through-hole packages.

TTL is particularly well suited to bipolar integrated circuits because additional inputs to a gate merely required additional emitters on a shared base region of the input transistor. If individually packaged transistors were used, the cost of all the transistors would discourage one from using such an input structure. But in an integrated circuit, the additional emitters for extra gate inputs add only a small area.

At least one computer manufacturer, IBM, built its own [[flip chip]] integrated circuits with TTL; these chips were mounted on ceramic multi-chip modules.<ref>{{citation |last1=Rymaszewski |first1=E. J. |last2=Walsh |first2=J. L. |last3=Leehan |first3=G. W. |title=Semiconductor Logic Technology in IBM |journal=IBM Journal of Research and Development |volume=25 |date=1981 |issue=5 |pages=603&ndash;616 |doi=10.1147/rd.255.0603}}</ref><ref>{{citation |last1=Seraphim |first1=D. P. |last2=Feinberg |first2=I. |title=Electronic Packaging Evolution in IBM |journal=IBM Journal of Research and Development |volume=25 |date=1981 |issue=5 |pages=617&ndash;630 |doi=10.1147/rd.255.0617}}</ref>