Editing Semiconductor device fabrication (section)

==Wafers==
{{Main|Wafer (electronics)|mono-crystalline silicon}}
A typical [[wafer (semiconductor)|wafer]] is made out of extremely [[silicon#Production|pure silicon]] that is [[Crystal growth|grown]] into [[Monocrystalline silicon|mono-crystalline]] cylindrical [[ingot]]s ([[boule (crystal)|boule]]s) up to 300&nbsp;mm (slightly less than 12&nbsp;inches) in diameter using the [[Czochralski process]]. These ingots are then sliced into wafers about 0.75&nbsp;mm thick and polished to obtain a very regular and flat surface. During the production process wafers are often grouped into lots, which are represented by a FOUP, SMIF or a wafer cassette, which are wafer carriers. FOUPs and SMIFs can be transported in the fab between machines and equipment with an automated OHT (Overhead Hoist Transport) AMHS (Automated Material Handling System).<ref name="auto11"/> Besides SMIFs and FOUPs, wafer cassettes can be placed in a wafer box or a wafer carrying box.<ref>{{cite book | url=https://books.google.com/books?id=_hTLDCeIYxoC&dq=Wafer+Cassette+box&pg=PA66 | isbn=978-1-4200-5153-7 | title=Microlithography: Science and Technology, Second Edition | date=3 October 2018 | publisher=CRC Press }}</ref>