Editing Pentium Pro (section)

==Fabrication==
The process used to fabricate the Pentium Pro processor die and its separate cache memory die changed, leading to a combination of processes used in the same package:
* The 133&nbsp;MHz Pentium Pro prototype processor die was fabricated in a 0.6&nbsp;μm BiCMOS process.<ref>Papworth, David B. (April 1996). "Tuning the Pentium Pro Microarchitecture". ''[[IEEE Micro]]'', pp. 14–15.</ref><ref name="FAB1">{{cite web |url=http://www.intel.com/support/processors/pentiumpro/sb/cs-011161.htm |title=Intel Pentium Pro Processors - Fact Sheet |archive-url=https://web.archive.org/web/20131207042845/http://www.intel.com/support/processors/pentiumpro/sb/cs-011161.htm |archive-date=December 7, 2013 |publisher=Intel}}</ref>
* The 150&nbsp;MHz Pentium Pro processor die was fabricated in a 0.50&nbsp;μm [[BiCMOS]] process.<ref name="FAB1"/><ref name="MPR 1995-11-13"/>
* The 166, 180, and 200&nbsp;MHz Pentium Pro processor die was fabricated in a 0.35&nbsp;μm BiCMOS process.<ref name="FAB1"/><ref name="MPR 1995-11-13"/>
* The 256&nbsp;KB L2 cache die was fabricated in a 0.50&nbsp;μm BiCMOS process.<ref name="FAB1"/><ref name="MPR 1995-11-13"/>
* The 512 and 1024&nbsp;KB L2 cache die was fabricated in a 0.35&nbsp;μm BiCMOS process.<ref name="FAB1"/><ref name="MPR 1995-11-13"/>