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== Types == [[File:AD570JD.jpg|thumb|A-to-D converter IC in a [[Dual in-line package|DIP]]]] Integrated circuits can be broadly classified into [[analog circuit|analog]],<ref>{{cite book |title=Analysis and Design of Analog Integrated Circuits |author1=Gray, Paul R. |author2=Hurst, Paul J. |author3=Lewis, Stephen H. |author4=Meyer, Robert G. |isbn=978-0-470-24599-6 |publisher=Wiley |year=2009 }}</ref> [[digital circuit|digital]]<ref>{{cite book |title=Digital Integrated Circuits |author1=Rabaey, Jan M. |author2=Chandrakasan, Anantha |author3=Nikolic, Borivoje |isbn=978-0-13-090996-1 |publisher=Pearson |year=2003 |url=https://archive.org/details/agilesoftwaredev00robe |edition=2nd }}</ref> and [[mixed-signal integrated circuit|mixed signal]],<ref>{{cite book |title=CMOS: Mixed-Signal Circuit Design |author=Baker, Jacob |publisher=Wiley |isbn=978-0-470-29026-2 |year=2008}}</ref> consisting of analog and digital signaling on the same IC. Digital integrated circuits can contain billions<ref name=Pascal/> of [[logic gate]]s, [[flip-flop (electronics)|flip-flops]], [[multiplexer]]s, and other circuits in a few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced [[manufacturing cost]] compared with board-level integration. These digital ICs, typically [[microprocessor]]s, [[Digital signal processor|DSPs]], and [[microcontroller]]s, use [[boolean algebra]] to process [[Binary number|"one" and "zero" signals]]. [[File:Intel 8742 153056995.jpg|right|thumb|The [[die (integrated circuit)|die]] from an Intel [[Intel MCS-48|8742]], an 8-bit [[NMOS logic|NMOS]] [[microcontroller]] that includes a [[CPU]] running at 12 MHz, 128 bytes of [[RAM]], 2048 bytes of [[EPROM]], and [[Input/output|I/O]] in the same chip]] Among the most advanced integrated circuits are the [[microprocessor]]s or "'''[[Processor core|cores]]'''", used in personal computers, cell-phones, etc. Several cores may be integrated together in a single IC or chip. Digital [[Computer memory|memory chips]] and [[application-specific integrated circuit]]s (ASICs) are examples of other families of integrated circuits. In the 1980s, [[programmable logic device]]s were developed. These devices contain circuits whose logical function and connectivity can be programmed by the user, rather than being fixed by the integrated circuit manufacturer. This allows a chip to be programmed to do various LSI-type functions such as [[logic gate]]s, [[adder (electronics)|adders]] and [[processor register|registers]]. Programmability comes in various forms β devices that can be [[Programmable read-only memory|programmed only once]], devices that can be erased and then re-programmed [[EPROM|using UV light]], devices that can be (re)programmed using [[flash memory]], and [[field-programmable gate array]]s (FPGAs) which can be programmed at any time, including during operation. Current FPGAs can (as of 2016) implement the equivalent of millions of gates and operate at [[Clock rate|frequencies]] up to 1 [[Hertz|GHz]].<ref name="Altera">{{cite news |url = https://www.altera.com/en_US/pdfs/literature/hb/stratix-10/s10-overview.pdf |title = Stratix 10 Device Overview |work = [[Altera]] |date = 12 December 2015 }}</ref> Analog ICs, such as [[sensor]]s, [[power network design (IC)|power management circuits]], and [[operational amplifier]]s (op-amps), process [[continuous signal]]s, and perform analog functions such as [[Amplifier|amplification]], [[active filter]]ing, [[demodulation]], and [[Frequency mixer|mixing]]. ICs can combine analog and digital circuits on a chip to create functions such as [[analog-to-digital converter]]s and [[digital-to-analog converter]]s. Such mixed-signal circuits offer smaller size and lower cost, but must account for signal interference. Prior to the late 1990s, [[radios]] could not be fabricated in the same low-cost [[CMOS]] processes as microprocessors. But since 1998, radio chips have been developed using [[RF CMOS]] processes. Examples include Intel's [[Digital Enhanced Cordless Telecommunications|DECT]] cordless phone, or [[802.11]] ([[Wi-Fi]]) chips created by [[Atheros]] and other companies.<ref name="IEEE-CMOS-dualband-n">{{cite web|last1=Nathawad|first1=L.|last2=Zargari|first2=M.|last3=Samavati|first3=H.|last4=Mehta|first4=S.|last5=Kheirkhaki|first5=A.|last6=Chen|first6=P.|last7=Gong|first7=K.|last8=Vakili-Amini|first8=B.|last9=Hwang|first9=J.|last10=Chen|first10=M.|last11=Terrovitis|first11=M.|last12=Kaczynski|first12=B.|last13=Limotyrakis|first13=S.|last14=Mack|first14=M.|last15=Gan|first15=H.|last16=Lee|first16=M.|last17=Abdollahi-Alibeik|first17=B.|last18=Baytekin|first18=B.|last19=Onodera|first19=K.|last20=Mendis|first20=S.|last21=Chang|first21=A.|last22=Jen|first22=S.|last23=Su|first23=D.|last24=Wooley|first24=B.|title=20.2: A Dual-band CMOS MIMO Radio SoC for IEEE 802.11n Wireless LAN|url=http://www.ewh.ieee.org/r6/scv/ssc/May2008_WLAN.pdf|website=IEEE Entity Web Hosting|publisher=IEEE|access-date=22 October 2016|archive-date=23 October 2016|archive-url=https://web.archive.org/web/20161023053607/http://www.ewh.ieee.org/r6/scv/ssc/May2008_WLAN.pdf|url-status=dead}}</ref> Modern [[:Category:electronic component distributors|electronic component distributors]] often further sub-categorize integrated circuits: * [[Digital integrated circuit|Digital ICs]] are categorized as logic ICs (such as [[microprocessors]] and [[microcontrollers]]), [[memory chip]]s (such as [[MOS memory]] and [[floating-gate]] memory), interface ICs ([[logic level|level shifters]], [[serializer/deserializer]], etc.), [[power management IC]]s, and [[Programmable logic device|programmable devices]]. * [[Analog integrated circuit|Analog ICs]] are categorized as [[linear integrated circuit]]s and [[RF circuit]]s ([[radio frequency]] circuits). * [[Mixed-signal integrated circuit]]s are categorized as [[data acquisition]] ICs (including [[A/D converter]]s, [[D/A converter]]s, [[digital potentiometer]]s), [[Clock generator|clock/timing ICs]], [[switched capacitor]] (SC) circuits, and [[RF CMOS]] circuits. * [[Three-dimensional integrated circuit]]s (3D ICs) are categorized into [[through-silicon via]] (TSV) ICs and Cu-Cu connection ICs.
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