Editing Dual in-line package (section)

===Variants===
[[Image:Nec8080.png|thumb|upright=1.4|Several PDIPs and CERDIPs. The large CERDIP in the foreground is an NEC 8080AF ([[Intel 8080]]-compatible) microprocessor.]]

Several DIP variants for ICs exist, mostly distinguished by packaging material:
* '''Ceramic dual in-line package (CERDIP or CDIP)'''
* '''Plastic dual in-line package (PDIP)'''
* '''Shrink plastic dual in-line package (SPDIP)''' &ndash; A denser version of the PDIP with a 0.07 in (1.778&nbsp;mm) lead pitch.
* '''Skinny dual in-line package (SDIP or SPDIP<ref>For instance, Microchip: http://www.microchip.com/packaging</ref>)''' &ndash; Sometimes used to refer to a "narrow" 0.300 in. (or 300 [[Thousandth of an inch|mil]]) wide DIP, normally when clarification is needed e.g. for DIP with 24 pins or more, which usually come in "wide" 0.600&nbsp;in wide DIP package. An example of a typical proper full spec for a "narrow" DIP package would be 300&nbsp;mil body width, {{convert|0.1|in|mm|2}} pin pitch.

[[EPROM]]s were sold in ceramic DIPs manufactured with a circular window of clear quartz over the chip die to allow the part to be erased by [[ultraviolet light]]. Often, the same chips were also sold in less expensive windowless PDIP or CERDIP packages as [[EPROM#Details|one-time programmable]] (OTP) versions. Windowed and windowless packages were also used for microcontrollers, and other devices, containing EPROM memory. Windowed CERDIP-packaged EPROMs were used for the [[BIOS]] ROM of many early IBM PC clones with an adhesive label covering the window to prevent inadvertent erasure through exposure to ambient light.

Molded plastic DIPs are much lower in cost than ceramic packages; one 1979 study showed that a plastic 14 pin DIP cost around US$0.063 and a ceramic package cost US$0.82.<ref>Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein ''Microelectronics Packaging Handbook: Semiconductor packaging'', Springer, 1997 {{ISBN|0-412-08441-4}} page 395</ref>