Editing Wafer (electronics) (section)

=== Cleaning, texturing and etching ===

Wafers are cleaned with [[weak acid]]s to remove unwanted particles. There are several standard cleaning procedures to make sure the surface of a silicon wafer contains no contamination. One of the most effective methods is the [[RCA clean]].
When used for [[solar cell]]s, the wafers are textured to create a rough surface to increase surface area and so their efficiency. The generated PSG ([[phosphosilicate glass]]) is removed from the edge of the wafer in the [[etching]].<ref>{{cite web |url=http://www.omron-semi-pv.eu/en/wafer-based-pv/front-end/wet-process.html |title=Wet Process |website=Omron Industrial Automation|access-date=November 26, 2008 |archive-url=https://web.archive.org/web/20090204143516/http://www.omron-semi-pv.eu/en/wafer-based-pv/front-end/wet-process.html |archive-date=February 4, 2009  }}</ref>