Editing STMicroelectronics (section)

===Grenoble, France===
[[Grenoble]] is one of the company's most important R&D centres, employing around 4,000 staff. The Polygone site employs 2,200 staff and is one of the historical bases of the company (ex SGS). All the historical wafer [[Fab (semiconductors)|fab]] lines are now closed but the site hosts the headquarters of many divisions (marketing, design, industrialization) and a R&D centre, focused on silicon and software design and fab process development.<ref>{{cite web|access-date=2023-11-03 |date=2013-07-24 |title=STMicroelectronics celebrates "Nano2017" R&D program at Crolles facility |publisher=powersystemsdesign.com |url=https://www.powersystemsdesign.com/articles/d-program-at-crolles-facility/36/702}}</ref>

The [[Crolles]] site hosts a {{convert|200|mm|in|0|abbr=on}} and a {{convert|300|mm|in|abbr=on}} fab and was originally built as a common R&D centre for submicrometre technologies as part of the 1990 ''Grenoble 92'' partnership between SGS-Thomson and [[Centre national d'études des télécommunications|CNET]], the R&D center of French telecom company '''France Telecom'''.<ref>{{cite web|access-date=2023-11-03 |date= |title=The Controversy over Offshoring: Power, Resistance and Translations in the French Semiconductor Industry |publisher=strategie-aims.com |url=https://www.strategie-aims.com/conferences/23-xxiieme-conference-de-l-aims/communications/2894-the-controversy-over-offshoring-power-resistance-and-translations-in-the-french-semiconductor-industry/download}}</ref>

The {{convert|300|mm|in|abbr=on}} fab was inaugurated by French president [[Jacques Chirac]], on 27 February 2003. It includes an R&D centre which focuses on developing new nanometric technology processes for 90-nm to 32-nm scale using {{convert|300|mm|in|abbr=on}} wafers and it was developed for ''The Crolles 2 Alliance''. This alliance of STMicroelectronics, [[TSMC]], [[NXP Semiconductors]] (formerly [[Philips]] semiconductor) and [[Freescale]] (formerly [[Motorola]] semiconductor) partnered in 2002 to develop the facility and to work together on process development.<ref>{{cite web|access-date=2023-11-03 |date= |title=Crolles2 Alliance Facility Expansion, Crolles |publisher=semiconductor-technology.com |url=https://www.semiconductor-technology.com/projects/crolles/}}</ref> The technologies developed at the facility were also used by global semiconductor [[foundry]] [[TSMC]] of Taiwan, allowing TSMC to build the products developed in Crolles on behalf of the Alliance partners who required such foundry capacity.