Editing Electrostatic discharge (section)

== Damage prevention in electronics ==
[[File:Static discharger with plastic guards.jpg|thumb|right|200px|A portion of a [[static discharger]] on an aircraft. Note the two sharp 3/8" metal micropoints and the protective yellow plastic.]]

Many electronic components, especially [[Integrated circuit|integrated circuits and microchips]], can be damaged by ESD.<ref name="Quarktwin"/> Sensitive components need to be protected during and after manufacture, during shipping and device assembly, and in the finished device. Grounding is especially important for effective ESD control. It should be clearly defined, and regularly evaluated.<ref name="In Compliance Magazine">{{cite web|url=http://incompliancemag.com/article/fundamentals-of-electrostatic-discharge-part-three-basic-esd-control-procedures-and-materials/|title=Fundamentals of Electrostatic Discharge|date=May 1, 2015|publisher=In Compliance Magazine|access-date=25 June 2015}}</ref>

{{see also|Electrostatic-sensitive device|Electrostatic discharge materials}}

===Protection during manufacturing===
[[File:ESD Jacket.jpg|thumb|ESD Jacket]]
In manufacturing, prevention of ESD is based on an Electrostatic Discharge Protected Area (EPA). The EPA can be a small workstation or a large manufacturing area. The main principle of an EPA is that there are no highly-charging materials in the vicinity of ESD sensitive electronics, all conductive and dissipative materials are grounded, workers are grounded, and charge build-up on ESD sensitive electronics is prevented. International standards are used to define a typical EPA and can be found for example from [[International Electrotechnical Commission]] (IEC) or [[American National Standards Institute]] (ANSI).

ESD prevention within an EPA may include using appropriate ESD-safe packing material, the use of conductive filaments on garments worn by assembly workers, [[conducting wrist strap]]s and foot-straps to prevent high voltages from accumulating on workers' bodies, [[Antistatic mat|anti-static mats]] or conductive flooring materials to conduct harmful electric charges away from the work area, and [[humidity]] control. Humid conditions prevent electrostatic charge generation because the thin layer of moisture that accumulates on most surfaces serves to dissipate electric charges.

Ionizers are used especially when insulative materials cannot be grounded. Ionization systems help to neutralize charged surface regions on insulative or [[dielectric]] materials. Insulating materials prone to triboelectric charging of more than 2,000&nbsp;V should be kept away at least 12 inches from sensitive devices to prevent accidental charging of devices through field induction. On aircraft, [[static discharger]]s are used on the [[trailing edge]]s of wings and other surfaces.

Manufacturers and users of integrated circuits must [https://www.antistat.com/blog/2017-11/esd-equipment-that-improves-safety-workplace-protection/ take precautions to avoid ESD]. ESD prevention can be part of the device itself and include special design techniques for device input and output pins. External protection components can also be used with circuit layout.

Due to dielectric nature of electronics component and assemblies, electrostatic charging cannot be completely prevented during handling of devices. Most of ESD sensitive electronic assemblies and components are also so small that manufacturing and handling is done with automated equipment. ESD prevention activities are therefore important with those processes where components come into direct contact with equipment surfaces. In addition, it is important to prevent ESD when an electrostatic discharge sensitive component is connected with other conductive parts of the product itself. An efficient way to prevent ESD is to use materials that are not too conductive but will slowly conduct static charges away. These materials are called static dissipative and have resistivity values below 10<sup>12</sup> ohm-meters. Materials in automated manufacturing which will touch on conductive areas of ESD sensitive electronic should be made of dissipative material, and the dissipative material must be grounded. These special materials are able to conduct electricity, but do so very slowly. Any built-up static charges dissipate without the sudden discharge that can harm the internal structure of [[silicon]] circuits.

===Protection during transit===
[[Image:Antistatic bag.jpg|thumb|right|250px|A [[network card]] inside an [[antistatic bag]], a bag made of a partially conductive plastic that acts as a [[Faraday cage]], shielding the card from ESD.]]
Sensitive devices need to be protected during shipping, handling, and storage. The  buildup and discharge of static can be minimized by controlling the surface resistance and volume resistivity of packaging materials. Packaging is also designed to minimize frictional or [[triboelectric]] charging of packs due to rubbing together during shipping, and it may be necessary to incorporate electrostatic or electromagnetic shielding in the packaging material.<ref>[https://telecom-info.njdepot.ericsson.net/site-cgi/ido/docs.cgi?ID=SEARCH&DOCUMENT=GR-1421& GR-1421, ''Generic Requirements for ESD-Protective Circuit Packed Containers''], Telcordia.</ref>  A common example is that semiconductor devices and computer components are usually shipped in an [[antistatic bag]] made of a partially conductive plastic, which acts as a [[Faraday cage]] to protect the contents against ESD.