Editing Bluetooth (section)

=== Architecture ===

==== Software ====
Seeking to extend the compatibility of Bluetooth devices, the devices that adhere to the standard use an interface called HCI (Host Controller Interface) between the host and the controller.

High-level protocols such as the SDP (Protocol used to find other Bluetooth devices within the communication range, also responsible for detecting the function of devices in range), RFCOMM (Protocol used to emulate serial port connections) and TCS (Telephony control protocol) interact with the baseband controller through the L2CAP (Logical Link Control and Adaptation Protocol). The L2CAP protocol is responsible for the segmentation and reassembly of the packets.

==== Hardware ====
The hardware that makes up the Bluetooth device is made up of, logically, two parts; which may or may not be physically separate. A radio device, responsible for modulating and transmitting the signal; and a digital controller. The digital controller is likely a CPU, one of whose functions is to run a Link Controller; and interfaces with the host device; but some functions may be delegated to hardware. The Link Controller is responsible for the processing of the baseband and the management of ARQ and physical layer FEC protocols. In addition, it handles the transfer functions (both asynchronous and synchronous), audio coding (e.g. [[SBC (codec)]]) and data encryption. The CPU of the device is responsible for attending the instructions related to Bluetooth of the host device, in order to simplify its operation. To do this, the CPU runs software called Link Manager that has the function of communicating with other devices through the LMP protocol.

A Bluetooth device is a [[short-range device|short-range]] [[wireless]] device. Bluetooth devices are [[semiconductor device fabrication|fabricated]] on [[RF CMOS]] [[integrated circuit]] ([[RF circuit]]) chips.<ref name="Happich">{{cite news |last1=Happich |first1=Julien |date=24 February 2010 |title=Global shipments of short range wireless ICs to exceed 2 billion units in 2010 |work=[[EE Times]] |url=https://www.eetimes.com/document.asp?doc_id=1254987 |url-status=live |access-date=25 October 2019 |archive-url=https://web.archive.org/web/20220212025004/https://www.eetimes.com/global-shipments-of-short-range-wireless-ics-to-exceed-2-billion-units-in-2010/ |archive-date=12 February 2022}}</ref><ref>{{cite book |last1=Veendrick |first1=Harry J. M. |title=Nanometer CMOS ICs: From Basics to ASICs |date=2017 |publisher=Springer |isbn=9783319475974 |page=243 |url=https://books.google.com/books?id=Lv_EDgAAQBAJ&pg=PA243 |access-date=26 October 2019 |archive-date=5 May 2020 |archive-url=https://web.archive.org/web/20200505161843/https://books.google.com/books?id=Lv_EDgAAQBAJ&pg=PA243 |url-status=live }}</ref>