Editing Printed circuit board (section)

=== Early PCBs ===
[[File:Mark-53-proximity-fuze-1943.jpg|thumb|upright=1.1|Proximity fuze Mark 53 production line 1944]]

The Austrian engineer [[Paul Eisler]] invented the printed circuit as part of a radio set while working in the UK around 1936. In 1941 a multi-layer printed circuit was used in German [[Naval mine#Influence mines|magnetic influence naval mines]].

Around 1943 the United States began to use the technology on a large scale to make [[proximity fuze]]s for use in World War II.<ref name="Harper03" /> Such fuzes required an electronic circuit that could withstand being fired from a gun, and could be produced in quantity. The Centralab Division of Globe Union submitted a proposal which met the requirements: a ceramic plate would be [[Screenprinting|screenprinted]] with metallic paint for conductors and carbon material for [[resistor]]s, with ceramic disc capacitors and subminiature vacuum tubes soldered in place.<ref>{{Cite book |last=Brunetti |first=Cledo |date=November 22, 1948 |title=New Advances in Printed Circuits |publisher=National Bureau of Standards |location=Washington, DC |url=https://archive.org/details/newadvancesinpri192brun }}</ref> The technique proved viable, and the resulting patent on the process, which was classified by the U.S. Army, was assigned to Globe Union. It was not until 1984 that the [[Institute of Electrical and Electronics Engineers]] (IEEE) awarded Harry W. Rubinstein its [[IEEE Cledo Brunetti Award|Cledo Brunetti Award]] for early key contributions to the development of printed components and conductors on a common insulating substrate. Rubinstein was honored in 1984 by his alma mater, the [[University of Wisconsin–Madison|University of Wisconsin-Madison]], for his innovations in the technology of printed electronic circuits and the fabrication of capacitors.<ref>Engineers' Day, [https://www.engr.wisc.edu/engage/alumni-relations/our-distinguished-alumni/ 1984 Award Recipients], College of Engineering, [[University of Wisconsin–Madison|University of Wisconsin-Madison]]</ref><ref>{{cite web |title=IEEE Cledo Brunetti Award Recipients |url=https://www.ieee.org/content/dam/ieee-org/ieee/web/org/about/awards/recipients/brunetti_rl.pdf |archive-url=https://web.archive.org/web/20180804200901/https://www.ieee.org/content/dam/ieee-org/ieee/web/org/about/awards/recipients/brunetti_rl.pdf |archive-date=August 4, 2018 |publisher=[[IEEE]] }}</ref> This invention also represents a step in the development of [[integrated circuit]] technology, as not only wiring but also passive components were fabricated on the ceramic substrate.