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===Epoxy resin curing agents=== Amines are often used as epoxy resin curing agents.<ref>{{Cite web |title=amine curing agent: Topics by Science.gov |url=https://www.science.gov/topicpages/a/amine+curing+agent |access-date=2022-03-01 |website=science.gov |language=en}}</ref><ref>{{Cite journal|last=Howarth|first=Graham|title=The use of water-based epoxies for anti-corrosive primers|journal=Pigment & Resin Technology|volume=24|issue=6|pages=3β6|date=1995-01-01|doi=10.1108/eb043156|issn=0369-9420}}</ref> These include [[dimethylethylamine]], [[cyclohexylamine]], and a variety of diamines such as 4,4-diaminodicyclohexylmethane.<ref name=Ullmann/> Multifunctional amines such as [[tetraethylenepentamine]] and [[triethylenetetramine]] are also widely used in this capacity.<ref>{{cite encyclopedia | vauthors = Eller K, Henkes E, Rossbacher R, HΓΆke H | chapter = Amines, Aliphatic | encyclopedia = Ullmann's Encyclopedia of Industrial Chemistry | year = 2005 | publisher = Wiley-VCH | location = Weinheim | doi = 10.1002/14356007.a02_001 |isbn=3527306730 }}</ref> The reaction proceeds by the lone pair of electrons on the amine nitrogen attacking the outermost carbon on the oxirane ring of the epoxy resin. This relieves ring strain on the epoxide and is the driving force of the reaction.<ref>Howarth G.A "Synthesis of a legislation compliant corrosion protection coating system based on urethane, oxazolidine and waterborne epoxy technology" pages 12, Chapter 1.3.1 Master of Science Thesis April 1997 Imperial College London</ref> Molecules with tertiary amine functionality are often used to accelerate the epoxy-amine curing reaction and include substances such as [[2,4,6-Tris(dimethylaminomethyl)phenol]]. It has been stated that this is the most widely used room temperature accelerator for two-component epoxy resin systems.<ref>{{Cite journal |last1=Seo |first1=Jiae |last2=Yui |first2=Nobuhiko |last3=Seo |first3=Ji-Hun |date=January 2019 |title=Development of a supramolecular accelerator simultaneously to increase the cross-linking density and ductility of an epoxy resin |url=https://doi.org/10.1016/j.cej.2018.09.020 |journal=Chemical Engineering Journal |volume=356 |pages=303β311 |doi=10.1016/j.cej.2018.09.020 |bibcode=2019ChEnJ.356..303S |issn=1385-8947}}</ref><ref>{{Cite journal |last1=Chen |first1=Fengjun |last2=Liu |first2=Fan |last3=Du |first3=Xiaogang |date=2023-01-10 |title=Molecular dynamics simulation of crosslinking process and mechanical properties of epoxy under the accelerator |url=https://onlinelibrary.wiley.com/doi/10.1002/app.53302 |journal=Journal of Applied Polymer Science |language=en |volume=140 |issue=2 |doi=10.1002/app.53302 |issn=0021-8995}}</ref>
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