Editing Glass (section)

=== Packaging ===
{{Main|Container glass}}
The inert and impermeable nature of glass makes it a stable and widely used material for food and drink packaging as [[glass bottle]]s and [[jar]]s. Most [[container glass]] is [[soda–lime glass]], produced by [[Glass production#Forming process|blowing and pressing]] techniques. Container glass has a lower [[magnesium oxide]] and [[sodium oxide]] content than flat glass, and a higher [[silica]], [[calcium oxide]], and [[aluminum oxide|aluminium oxide]] content.<ref name=seward>"High temperature glass melt property database for process modeling"; Eds.: Thomas P. Seward III and Terese Vascott; The American Ceramic Society, Westerville, Ohio, 2005, {{ISBN|1-57498-225-7}}</ref> Its higher content of water-insoluble oxides imparts slightly higher [[chemical durability]] against water, which is advantageous for storing beverages and food. Glass packaging is sustainable, readily recycled, reusable and refillable.<ref>{{Cite web|url=https://feve.org/about-glass/|title=Why choose Glass?|website=FEVE}}</ref>

For electronics applications, glass can be used as a substrate in the manufacture of [[integrated passive devices]], [[thin-film bulk acoustic resonator]]s, and as a [[hermetic seal]]ing material in device packaging,<ref>{{cite book |last1=Sun |first1=P. |last2=et |first2=al. |title=2018 19th International Conference on Electronic Packaging Technology (ICEPT) |chapter=Design and Fabrication of Glass-based Integrated Passive Devices |doi=10.1109/ICEPT.2018.8480458 |year=2018 |pages=59–63 |isbn=978-1-5386-6386-8 |s2cid=52935909 }}</ref><ref>{{cite book |last1=Letz |first1=M. |last2=et |first2=al. |title=2018 IEEE 68th Electronic Components and Technology Conference (ECTC) |chapter=Glass in Electronic Packaging and Integration: High Q Inductances for 2.35 GHZ Impedance Matching in 0.05 mm Thin Glass Substrates |doi=10.1109/ECTC.2018.00167 |year=2018 |pages=1089–1096 |isbn=978-1-5386-4999-2 |s2cid=51972637 }}</ref> including very thin solely glass based encapsulation of integrated circuits and other semiconductors in high manufacturing volumes.<ref>{{cite book |last1=Lundén |first1=H. |last2=et |first2=al. |title=Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) |chapter=Novel glass welding technique for hermetic encapsulation |year=2014 |doi=10.1109/ESTC.2014.6962719 |pages=1–4 |isbn=978-1-4799-4026-4 |s2cid=9980556 }}</ref>