Editing Light-emitting diode (section)

== Manufacturing ==
LED manufacturing involves multiple steps, including epitaxy, chip processing, chip separation, and packaging.<ref>{{Cite journal |last1=Stern |first1=Maike Lorena |last2=Schellenberger |first2=Martin |date=2020-03-31 |title=Fully convolutional networks for chip-wise defect detection employing photoluminescence images |url=http://dx.doi.org/10.1007/s10845-020-01563-4 |journal=Journal of Intelligent Manufacturing |volume=32 |issue=1 |pages=113–126 |doi=10.1007/s10845-020-01563-4 |issn=0956-5515|arxiv=1910.02451 |s2cid=254655125 }}</ref>

In a typical LED manufacturing process, encapsulation is performed after probing, dicing, die transfer from wafer to package, and wire bonding or flip chip mounting,<ref>{{cite journal | doi=10.1007/s10854-019-02393-8 | title=Effects of humidity and phosphor on silicone/Phosphor composite in white light-emitting diode package | date=2019 | last1=Hoque | first1=Md Ashraful | last2=Bradley | first2=Robert Kelley | last3=Fan | first3=Jiajie | last4=Fan | first4=Xuejun | journal=Journal of Materials Science: Materials in Electronics | volume=30 | issue=23 | pages=20471–20478 | doi-access=free }}</ref> perhaps using [[indium tin oxide]], a transparent electrical conductor. In this case, the bond wire(s) are attached to the ITO film that has been deposited in the LEDs.

Flip chip circuit on board (COB) is a technique that can be used to manufacture LEDs.<ref>{{Cite web |title=3-Pad LED Flip Chip COB |url=https://www.led-professional.com/resources-1/articles/3-pad-led-flip-chip-cob |access-date=2024-02-15 |website=LED professional - LED Lighting Technology, Application Magazine |language=en}}</ref>