Editing Semiconductor device fabrication (section)

==Hazardous materials==
{{See also|Health hazards in semiconductor manufacturing occupations}}
Many toxic materials are used in the fabrication process.<ref>{{cite web |website=CNET |url=https://www.cnet.com/tech/tech-industry/why-tech-pollutions-going-global/ |title=Why tech pollution's going global |date=April 25, 2002 |access-date=February 17, 2024}}</ref> These include:
* poisonous elemental [[dopants]], such as [[arsenic]], [[antimony]], and [[phosphorus]].
* poisonous compounds, such as [[arsine]] and [[phosphine]] containing arsenic and phosphorus respectively, used in ion implantation doping, [[tungsten hexafluoride]], used in CVD deposition of tungsten in transistor interconnects, [[silane]] used for depositing polysilicon,<ref>{{Cite book|url=https://books.google.com/books?id=rbazz2eNu6QC&q=silicon+epitaxy+cvd+gas|title=Epitaxial Silicon Technology|first=B.|last=Baliga|date=December 2, 2012|publisher=Elsevier|isbn=978-0-323-15545-8 |via=Google Books}}</ref> [[Trichlorosilane]] used to create high purity polysilicon which is used for silicon photovoltaics or for polysilicon for the Czochralski process used to make monocrystalline silicon wafers,<ref>https://news.metal.com/newscontent/101647120/photovoltaic-demand-drives-the-highest-price-of-trichlorosilane-to-reach-40000-per-ton-of-supply-shortage-support-continued-to-be-strong-in-the-short-term</ref><ref>https://www.cityu.edu.hk/phy/appkchu/AP6120/2.PDF</ref> or for depositing silicon films<ref>https://iopscience.iop.org/article/10.1149/2.0031502jss</ref>
* highly reactive liquids, such as [[hydrogen peroxide]], fuming [[nitric acid]], [[sulfuric acid]], and [[hydrofluoric acid]], used in etching and cleaning.

It is vital that workers not be directly exposed to these dangerous substances. The high degree of automation common in the IC fabrication industry helps to reduce the risks of exposure. Most fabrication facilities employ exhaust management systems, such as wet scrubbers, combustors, heated absorber cartridges, etc.,<ref>{{cite web | url=https://www.semiconductor-digest.com/abating-potentially-dangerous-particles-2-5m-and-smaller/ | title=Abating Potentially Dangerous Particles 2.5 µm and Smaller | date=3 February 2020 }}</ref><ref>{{cite web |url=https://19january2017snapshot.epa.gov/sites/production/files/2015-06/documents/solid.pdf |title=Solid Scrubber for the Semiconductor Industry |work=SBIR Success Stories |publisher=[[United States Environmental Protection Agency]]}}</ref><ref>{{cite web | url=https://cleanroomtechnology.com/hi-tech-without-costing-the-earth-55605 | title=Hi-tech without costing the Earth }}</ref> to control the risk to workers and to the environment.