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== Packaging methods == {{Main|Electronic packaging}} Many different methods of connecting components have been used over the years. For instance, early electronics often used [[point to point wiring]] with components attached to wooden breadboards to construct circuits. [[Printed circuit board#"Cordwood" construction|Cordwood construction]] and [[wire wrap]] were other methods used. Most modern day electronics now use printed circuit boards made of materials such as [[FR-4|FR4]], or the cheaper (and less hard-wearing) Synthetic Resin Bonded Paper ([[SRBP]], also known as Paxoline/Paxolin (trade marks) and FR2) β characterised by its brown colour. Health and environmental concerns associated with electronics assembly have gained increased attention in recent years, especially for products destined to go to European markets. [[File:MOS6581_chtaube061229.jpg|right|thumb|Through-hole devices mounted on the circuit board of a mid-1980s [[home computer]]. Axial-lead devices are at upper left, while blue radial-lead capacitors are at upper right.]] Electrical components are generally mounted in the following ways: * [[Through-hole]] (sometimes referred to as 'Pin-Through-Hole') * [[Surface mount]] * [[Chassis mount]]{{clarify|date=September 2023}} * [[Rack mount]] * [[Land grid array|LGA]]/[[Ball grid array|BGA]]/[[Pin grid array|PGA]] socket
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