Editing Dual in-line package (section)

==Applications==

===Types of devices===
[[File:Breadboard counter.jpg|thumb|upright=1.85|An operating prototyped circuit on a solderless [[breadboard]] incorporating four DIP ICs, a DIP LED bargraph display (upper left), and a DIP 7-segment LED display (lower left)]]

DIPs are commonly used for [[integrated circuit]]s (ICs). Other devices in DIP packages include resistor networks, [[DIP switch]]es, [[Light-emitting diode|LED]] [[segmented display|segmented]] and bar graph displays, and electromechanical [[relay]]s.

DIP connector plugs for ribbon cables are common in computers and other electronic equipment.

Dallas Semiconductor manufactured integrated DIP [[real-time clock]] (RTC) modules which contained an IC chip and a non-replaceable 10-year lithium battery.

DIP [[Pin header|header]] blocks on to which discrete components could be soldered were used where groups of components needed to be easily removed, for configuration changes, optional features or calibration.

===Uses===
[[File:Ultrasound-PreAmp-Breadboard.jpg|thumb|upright=1.2|Breadboard prototype: Ultrasonic microphone preamp build with SMD-parts soldered to DIP and SIP breakout boards]]
The original dual-in-line package was invented by Bryant "Buck" Rogers in 1964 while working for Fairchild Semiconductor. The first devices had 14 pins and looked much like they do today.<ref>Dummer, G.W.A. ''Electronic Inventions and Discoveries'' 2nd ed. Pergamon Press {{ISBN|0-08-022730-9}}</ref> The rectangular shape allowed integrated circuits to be packaged more densely than previous round packages.<ref>[http://www.computerhistory.org/semiconductor/timeline/1965-Package.html Computer Museum retrieved April 16, 2008]</ref> The package was well-suited to automated assembly equipment; a PCB could be populated with scores or hundreds of ICs, then all the components on the circuit board could be soldered at one time on a [[wave soldering]] machine and passed on to automated testing machines, with very little human labor required. DIP packages were still large with respect to the integrated circuits within them. By the end of the 20th century, [[surface-mount technology|surface-mount]] packages allowed further reduction in the size and weight of systems. DIP chips are still popular for circuit prototyping on a [[breadboard]] because of how easily they can be inserted and used there.

DIPs were the mainstream of the microelectronics industry in the 1970s and 1980s. Their use has declined in the first decade of the 21st century due to the emerging new [[surface-mount technology]] (SMT) packages such as [[plastic leaded chip carrier]] (PLCC) and [[small-outline integrated circuit]] (SOIC), though DIPs continued in extensive use through the 1990s, and still continue to be used today. Because some modern chips are available only in surface-mount package types, a number of companies sell various prototyping adapters to allow those surface-mount devices (SMD) to be used like DIP devices with through-hole breadboards and soldered prototyping boards (such as [[stripboard]] and [[perfboard]]). (SMT can pose quite a problem, at least an inconvenience, for prototyping in general; most of the characteristics of SMT that are advantages for mass production are difficulties for prototyping.)

For programmable devices like [[EPROM]]s and [[Generic array logic|GAL]]s, DIPs remained popular for many years due to their easy handling with external programming circuitry (i.e., the DIP devices could be simply plugged into a socket on the programming device.) However, with [[In-System Programming]] (ISP) technology now state of the art, this advantage of DIPs is rapidly losing importance as well.

Through the 1990s, devices with fewer than 20 leads were manufactured in a DIP format in addition to the newer formats. Since about 2000, newer devices are often unavailable in the DIP format.

===Mounting===
DIPs can be mounted either by [[through-hole technology|through-hole soldering]] or in sockets. Sockets allow easy replacement of a device and eliminates the risk of damage from overheating during soldering. Generally sockets were used for high-value or large ICs, which cost much more than the socket. Where devices would be frequently inserted and removed, such as in test equipment or EPROM programmers, a [[zero insertion force]] socket would be used.

DIPs are also used with breadboards, a temporary mounting arrangement for education, design development or device testing. Some hobbyists, for one-off construction or permanent prototyping, use [[point-to-point construction#'Dead bug' construction|point-to-point]] wiring with DIPs, and their appearance when physically inverted as part of this method inspires the informal term "dead bug style" for the method.

<gallery widths="220px" heights="165px">
DIP sockets.jpg|0.3" wide DIP sockets with dual-wipe contacts for 16-, 14-, and 8-pin DIP ICs
DIL socket 16p.jpg|0.3" wide 16-pin DIP socket with machined round contacts for DIP16 IC
Textoolfassung 28 (smial).jpg|[[Zero insertion force]] (ZIF) socket for 0.6" wide DIP28W IC, commonly used on [[EPROM]] IC programmers
28 Pin IC Socket.jpg|0.3" wide DIP socket for narrow DIP28 IC, also known as DIP28N, commonly used on older Arduino boards
Arduino UNO unpacked.jpg|[[Arduino]] UNO R2 board with [[ATmega328|ATmega328P]] 8-bit microcontroller in DIP28N IC socket
MK38P70 and MBM2716.jpg|A DIP [[piggyback microcontroller]] from [[MOSTEK]] with attached DIP socket for an EPROM, both 0.6" wide
</gallery>